Packaging design of energy storage mainframe

Why are thermal challenges important in electronic packaging design?

With increased performance requirements for smaller, more capable, and more efficient electronic systems, thermal challenges have become critical issues in electronic packaging design. Breakthroughs are needed in advanced cooling solutions and pragmatic design at chip, board, and system package levels.

Why is thermal management important in electronic packaging design?

This trend in microprocessor architecture results in increased heat densities which mandate that thermal management be given a high priority in electronic packaging design so as to maintain system performance and reliability.

What materials are used for electronic packaging?

Materials used for electronic packaging are usually gray bodies. All materials radiate thermal energy in amounts determined by their temperature, where the energy is carried by photons of light in the infrared and visible portions of the electromagnetic spectrum.

What are the performance parameters of energy storage capacity?

Our findings show that energy storage capacity cost and discharge efficiency are the most important performance parameters. Charge/discharge capacity cost and charge efficiency play secondary roles. Energy capacity costs must be ≤US$20 kWh –1 to reduce electricity costs by ≥10%.

Which package structures have different thermal resistance characteristics?

Different package structures have different thermal resistance characteristics. Packages such as ABGAs (advanced ball grid arrays) and FCBGAs (flip chip ball grid arrays), which feature a copper lid to which the chip is directly attached with thermally conductive paste, offer excellent thermal resistance characteristics.

Why do we need advanced materials & process improvements in packaging & cooling?

In response to these critical needs, advanced materials and process improvements in packaging and cooling technology are required to provide high thermal transfer efficiency, well-controlled thermal transient behavior, environmental compatibility, low weight, and acceptable material and fabrication cost.